Triton Microtechnologies is the leader in the design and manufacture of high-performance 2.5D and 3D Through Glass Via (TGV) interposers.
As we rapidly approach the barrier and performance limits of silicon, the need increases for a greater number of components in smaller package areas and the need for non-silicon based materials to better support this next generation assembly.
Triton's proprietary technology offers faster cycle times, KGD testing at higher packaging integration levels, and the lowest cost/unit in the marketplace.
9.30.13 Triton will be presenting at IWLPC 2013: "2.5D & 3D Packaging Platform for Next Generation RF & Digital Modules Using Through Glass Via (TGV) Technology." A paper authored by Triton.
Sept 30-Oct 3
Orlando, FL ECTC
San Jose, CA