Triton Microtechnologies designs and manufactures high-performance Through Glass Via (TGV) interposers for 2.5D / 3D advanced packaging, display, optical, medical, and life science electrical packaging technologies.
As we rapidly approach the barrier and performance limits of silicon, the need increases for a greater number of components in smaller package areas and the need for non-silicon based materials to better support this next generation assembly.
Triton's proprietary technology offers faster cycle times, KGD testing at higher packaging integration levels, and the lowest cost/unit in the marketplace.
PHOENIX (June 25, 2014) – Triton wins the AZ Innovation Challenge!
November 11-13, 2014: IWLPC, San Jose CA